|
Rigid Printed Circuits
• ISO 9002 Certified
• QS 9000 Certified
• Underwriter's Laboratory (U.L.) Certified |
| Types Of Boards |
Single-Sided |
Double-Sided |
Multi-Layer |
| Material |
FR-1,FR-2,FR-3,
CEM-1,CEM-3 |
FR-4 |
FR-4
(up to 40) |
| Min. Line With/Line Spacing (mil) |
5/5 |
3/3 |
3/3 |
| Min. Hole Size (mil) |
31 |
15 |
10 |
| Material Thickness |
Per Customer Request |
| Min. distance from hole edge
to board edge |
The thickness of
the base material
(e.g. 1/32, 1/16) |
1/2 of the base
mat'l thickness |
1/2 of the base
mat'l thickness |
| Solder Mask |
U.V. Cureable Liquid Photoimageable
(LPI) |
| Gold Finger Plating |
No |
Hard & Soft Gold |
Hard & Soft Gold |
| Legend Printing |
As per specifications |
| V-Groove |
Yes |
Yes |
Yes |
| Punch & Reset |
Yes |
No |
No |
| Slot & Tabs |
Yes |
Yes |
Yes |
| Electrical Test (open short test) |
Upon Request |
Yes |
Yes |
| Production Capacity (sq. ft./month) |
350,000 |
300,000 |
250,000 |
| No. of Employees |
350 |
1,000 |
1,000 |
| U.L. Approval |
Yes |
Yes |
Yes |
| ISO-9002 |
Yes |
Yes |
Yes |
| QS-9000 |
Yes |
Yes |
Yes |
| Lead Time/New Orders |
3 - 4 Weeks |
| Lead Time/Repeat Orders |
2 - 3 Weeks |
| Blind Vias |
No |
Yes |
Yes |
| Buried Vias |
No |
Yes |
Yes |
| Carbon Ink Thru-hole |
Yes |
No |
No |
| Silver Ink Thru-hole |
Yes |
No |
No |
| Controlled Impedance |
Yes, with carbon or
silver ink only |
Yes |
Yes |
